Designed for semiconductor processes: low erosion and ultra-low particle generation in harsh plasma environments, with excellent thermal stability, very low outgassing, good elastic recovery and mechanical strength. Suitable for both static and dynamic sealing.
High-purity FFKM is formulated for processes where a seal is not allowed to contaminate what it seals. Plasma resistance, very low outgassing and ultra-low particle generation make it the standard choice in semiconductor process chambers — a market we support alongside our oilfield products.
Key Features
- Temperature: −10 to 280 °C (short-term to 300 °C)
- Plasma resistant, ultra-low particle, low outgassing
- Applications: semiconductor process equipment
Typical Applications
- Semiconductor etch, deposition and ashing chambers
- Plasma and reactive-gas environments
- Vacuum and ultra-clean process equipment
- High-purity chemical delivery systems
- Pharmaceutical and food processes with strict extractables limits
Custom Options & Ordering
- Material: high purity FFKM perfluoroelastomer
- Temperature: −10 to 280 °C, short-term to 300 °C
- Ultra-low particle generation and low outgassing
- Cleanroom packed on request
Request a Quote
Tell us your medium, working temperature, pressure and dimensions and we will recommend the compound and geometry for your duty. Reach our engineering team at sales@aobo.biz or +86-573-87855272, or use our contact page.